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3D-IC Ϊʲôһֱ޷г

Mentor Graphics ˾?? Michael White?? 20160606 ?? ղ0
һصĸ۰ɡЩ˵ܶ죿

ĦʧЧڣҲdz¡

ûܹʹôͳ 2D ǨƵȽƳ̡

3D-ICơԽĦɡԸ⣩Ϊгõŷ

ñ˵ɣҴ 20 nm ׶֮ǰЩۣ 4 ˡʵУֿʲôأʵЩԤྶͥ

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ƪ˵۵㣣ĦɲδʧЧ޷ǰԶһڵ㣬ǿԿкܶ๫˾ڽ 20 nm µƿѭ 2D һֱصķЩֻͣҪϺ;ϿУ˾á

ԽĦ (3D-IC)

3D-IC Ӧȡ˳ɹ Geoffrey A. Moore Inside the Tornado ļڵġ蹵ͼ 11 δг㷺 3D-IC

ͼ1. 3D-IC ĹʶĦڵĺ蹵
ͼ1. 3D-IC ĹʶĦڵĺ蹵

г Gartner Ըüһ Gartner ڣͼ 2 Gartner ģУ͹ڡĦĺ蹵ıϡ

ͼ2.Gartner ڱΪ Gartner ڡ
ͼ2.Gartner ڱΪ Gartner ڡ

3D-IC Ŀǰȡõijɹԭ

3D-IC ں蹵ǻ͹ڶȡһЩɼȴһֱ޷гٿһȡõһЩɼ

2.5D-IC

Xilinx ˳ΪѵƬ (SSI) Ʒʹù˾ĺߴ FPGAͨСdieijߴdieʣӶʲ2

3D-IC

HiSilicon TSMC 칹 CoWoSԲоƬ3D-IC װտ˽ 16nm ߼оƬ 28nm I/O оƬ紦3

NVIDIA Ƴ GPUDirect ʹ GPU 豸ֱӶд豸ڴ棬 CPU Լ̼ܼ͹صʱ4

AMD ٴԪ (APU) Ŭ CPU GPU ϵоƬϣԴ˴һ칹ϵͳܹṩԼ۱ȵȫλ㡣5

ЩƷʲôͬ㣿ǶǸĴоƬƷܳеӸоƬĹнӦɱӡ֮أ

SamsungHynix Micron ˻ڴˣҪĿǽûڴһµ DRAM 洢ܹ߼Ƴͨͨ (TSV) ѵ洢die

๫˾ڽлڹ CMOS ͼ񴫸Ŀ佫ڴDZӦУָͼﴫУԼӿſơͨӺ͵ӵܼɣڵһоƬ΢ͻӹӹܣӶʹڴд׼ȣʵĴģӼɵ·

ΪǿԴЩгӦеóһЩȤĽۡΧ 3D-IC ṩһַͨdieϽиŻ߼ʹܷװøܣչµ;ǿԿʹڽ죬гӦҲδʵһЩ 2.5/3D-IC ӦʹôƷͨܵľܷװٶ֮ơ3D-IC ΪЩӦôʵʼֵδԤĦɵ⡣

3D-IC Խ蹵

ʲôص 3D-IC ޷Խ蹵͹ڣڱ߿ԭҪм㣺ʼ̫ͣĿǰķ̫ȱͿͻڱԼɱڼУڲߣ缼ߺԶߣΪ׸¼֮ˣΪһֶΣԴѴͳעĿľ/ҵࡣ

෴гϣʵ߳ǣ¼ԡǸϲԼƳ̡̺ƷиĽϣͬҵŷijɹԼгȹӦṩĽҪһоҵĽ

TSMC ڹн 2.5D-IC CoWoS οԼ GLOBALFOUNDRIES ͬƷȵװͲ (OSAT) ǺȤijԣԴгܽܵĽʹ߲Щڹнĸ߼װгȡһЩɼݱ֪нijɱ޷й㷺ɱԼ򵥹ΪнΪʹôͳԲ̹һоƬ

ͳɱĽܸıϷ򣬶˿ܻҵȹ˾ṩȳԲװ (FOWLP)ݲ˹̹о˾͸¶TSMC ȳ (InFO) ӦõУü TSMC FOWLP ͡

˹̹ Mark Li ·װһЩƣ InFO ɾȥ˷װеĻףֻ SoC ĺȴ 1 mm 0.8 mm ͡ Li ˵߼оƬӡˢ·֮ľ룬ԼӿɢȡýϸߵģҲṩ 20% ʹйģ

ݲ˹̹Ԥ⣬ȡгϵijɹܻΪʹ 3D-IC Խ蹵гش¼һͨҵȹ˾עĿijɹгȹӦ̵׽ɴ͡ʵߡйǡģʽ죩˵ 3D-IC սڲг2016 ӦǷܽһꡣ


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